Trade Lead Description:
Product information: 1) is mainly used for semiconductor wafer cleaning corrosion; 2) standard etching process (using HF/HNO3, KOH, NaOH, H3PO4, BOE, DHF, SPM, SOM, etc.); 3) Control mode: manual, semi-automatic, automatic; 4) Material: according to customer requirements and technology selection, optional PP, PVC, PVDF, quartz, stainless steel and other materials; Advantages and Features: Modular design; based on your process and needs, to provide you with a special design; customized according to customer's budget; the best cleaning Treatment Process; cost-effective; many modules for the election; user-friendly interface; safety and environmental protection; easy to maintain; non-standard products, welcome your specific needs based on detailed consultation!
Type of Offer: |
Offer to Sell |
Quantity: |
Negotiable |
Packaging: |
Negotiable |
Price / Incoterms Conditions: |
Negotiable |
Posted from China - Jiangsu on 23 August, 2011
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